GL300 Cluster is a modular, fully-automatic nanoimprint lithography mass production system that combines all related NIL pre-process steps including wafer cleaning, plasma surface treatment, resist spin-coating, baking, cooling and full-field UV-NIL process in a single platform for 200/300mm wafers.
The GermanLitho proprietary CLIV (Contact Litho into Vacuum) technology ensures the accuracy of imprinted structures and replication fidelity. It enables fully-automatic mass production of high resolution (better than 10nm*), high aspect ratio (better than 10 : 1 *) nanostructures on 200/300mm wafers. The system adopts a modular design, allowing users to freely configure the number of modules for cleaning, coating, baking, cooling, plasma surface treatment, AOI inspection, Post Cure, and nanoimprinting according to process requirements and production cycle time, achieving optimal production efficiency. From the replication and exchange of flexible composite workings stamps, to NIL wafer pre-processing and high resolution nanoimprinting, all process steps are carried out full-automatically in a closed and clean mini-environment to ensure the imprint quality. The GL300 Cluster nanoimprint mass production system is suitable for large-scale mass production of DOE, AR/VR waveguide (including slanted gratings), WGP, metalens, biochip, LED PSS, MLA and other applications.
Volume-proven fully-automatic 200/300mm nanoimprint lithography mass production system for high resolution, high aspect ratio nanostructures.
CLIV technology ensures the accuracy of imprinted structures and replication fidelity.
Cassette to cassette automatic wafer loading/unloading, optical pre-alignment.
Automatic flexible composite working stamp replication, automatic working stamp exchange. Suitable for mass production.
Fully-automatic NIL substrate pretreatment processes, including substrate cleaning, spin-coating, baking, cooling, plasma surface treatment (optional) etc.
Fully-automatic nanoimprinting processes, including working stamp replication, alignment, imprinting, curing and separation, etc.
All process steps are carried out in a closed and clean mini-environment to ensure the imprinting quality.
High power UV LED panel light source (365nm, light intensity >1000mW/cm2) with water cooling, possible customization of power and wavelength of the light source, optional post cure module, perfectly support a variety of commercial nanoimprint materials.
Throughput up to 100 wph possible, suitable for large-scale mass production of DOE, AR/VR waveguide (including slanted gratings), WGP, metalens, biochip, LED PSS, MLA and other applications.
A set of nanoimprint processes and materials starter-kit will be delivered together with the machine, covering processes for DOE, AR slanted grating, high density, high aspect ratio structures and other applications etc., to enable our customers beginning with world leading level of nanoimprint technology based on our experiences.
Substrate size |
200mm (open cassette, customized SMIF) / 300mm (FOUP) Special size can be customized |
Substrate material |
Silicon, glass, quartz, plastic, metal, etc. |
Wafer loading & unloading |
Cassette to cassette automatic loading/unloading |
Wafer pre-alignment |
Optical pre-alignment |
Supported NIL process |
UV-NIL with GermanLitho proprietary CLIV (Contact Litho into Vacuum) technology ensures the accuracy of imprinted structures and replication fidelity., suitable for imprinting of high resolution, high aspect ratio nanostructures |
Pre-treatment process steps for nanoimprint |
Wafer Cleaning (brush, two-fluid, megasonic), spin-coating, baking, cooling, Plasma surface treatment etc. |
Resolution |
Better than 10 nm* |
Aspect ratio |
Better than 10:1 * |
Residual layer thickness（RLT） |
Less than 10nm* |
UV curing light source |
High power UV LED panel light source (365nm), light intensity >1000mW/cm2 (2000mW/cm2 optional) |
Mini-environment and climate control |
Standard, external environment class 100, internal environment better than class 10* |
Automatic imprinting |
Supported |
Automatic separation |
Supported |
Automatic working stamp replication |
Supported |
Automatic working stamp exchange |
Supported |
Automatic alignment |
Optional |
Post Cure |
Optional |
Online AOI inspection |
Optional |
Throughput |
Up to 100 wph* |