GL300 MLA is the GermanLitho latest fully-automatic UV nanoimprint lithography equipment, which is capable of parallel imprinting polymer micro- and nano-optic components on 200/300 mm wafers, developed dedicated for Wafer Level Optics (WLO) processes.
The equipment supports cassette to cassette automatic wafer loading and unloading, automatic flexible composite working stamp replication and exchange. All process steps are carried out in a closed and clean environment to ensure the imprint quality. The integrated high-precision automatic resist dispensing system, APC (Active mold/substrate Parallel Control) technology, and automatic separation function ensure the replication fidelity, uniformity (TTV), and yield for large-area WLO production. The automatic alignment system enables Wafer Level Stacking (WLS) process. GL300 MLA is suitable for development and mass production of DOE, Diffuser, MLA, Fresnel lenses and other products.
Fully-automatic nanoimprint lithography equipment for 200/300mm WLO processes.
APC (Active mold/substrate Parallel Control) technology ensures the large area TTV uniformity of imprinted wafers.
Cassette to cassette automatic wafer loading and unloading, optical pre-alignment.
Automatic flexible composite working stamp replication, automatic working stamp exchange. Suitable for mass production.
Including automatic high-precision resist dispensing system.
Fully-automatic process including working stamp replication, alignment, imprinting, curing and separation, etc., all process steps are carried out in a closed and clean mini-environment to ensure the imprinting quality.
High power UV LED panel light source (365nm, light intensity >1000mW/cm2) with water cooling, possible customization of power and wavelength of the light source, perfectly support a variety of commercial nanoimprint materials.
A set of nanoimprint processes and materials starter-kit for WLO will be delivered together with the machine, to enable our customers beginning with world leading level of nanoimprint technology based on our experiences.
Substrate size |
200mm (Open cassette, SMIF customized) / 300mm (FOUP) (Special sizes can be customized) |
Substrate material |
Silicon, glass, quartz, plastic, metal, etc. |
Wafer loading & unloading |
Cassette to cassette automatic wafer loading/unloading |
Wafer pre-alignment |
Optical pre-alignment |
Supported NIL process |
UV-NIL with APC (Active mold/substrate Parallel Control) technology, suitable for large area WLO, WLS and other processes |
Resolution |
Better than 10 nm* |
Aspect ratio |
Better than 10: 1* |
TTV control |
Micrometer accuracy* (200/300mm wafer) |
UV curing light source |
High power UV LED panel light source (365nm), light intensity >1000mw/cm2 (2000mw/cm2optional） |
Mini-environment and climate control |
Standard, external environment class 100, internal environment better than class10* |
Automatic imprinting |
Supported |
Automatic separation |
Supported |
Automatic resist dispensing |
Supported |
Automatic working stamp replication |
Supported |
Automatic working stamp exchange |
Supported |
Automatic alignment |
Optional |